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| Wistron
has a long history
of strong manufacturing
services. We offer
a full suite of industry
- leading manufacturing
services, from PCB
assembly, sub-systems
assembly, system integration
(including CTO/BTO
product assembly)
to all related in-process
quality assurance
testing. The manufacturing
process for the world's
most respected brand
name products are
coordinated amongst
several plants on
different continents. |
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| Experience
means
that Wistron
can seamlessly
integrate
the product
development
stages
with the
required
manufacturing
processes
to create
an efficient
NPI process.
Wistron
knows
the many
concerns
of our
customers,
so we
developed
a manufacturing
process
and IT
infrastructure
based
on a flexible,
efficient
approach
to manage
our customers'
changing
requirements. |
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| All
processes are
managed by a
robust shop
floor control
system (SFCS)
that
allows constant
monitoring and
corrections.
Through our
Order Tracking
System (OTS)
customers track
products down
to component
levels.The links
between customers
and Wistron
provide the
necessary information
flow to maximize
the production
process efficiency.
This enhances
our customers'
overall product
introduction
planning as
well as preparations
for the after-sales
servicing of
products upon
reaching the
marketplace. |
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| Manufacturing
capabilities |
| ·
System
integration |
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- Flow-line
and
workcell
line
types |
| - BTO
(build-to-order)
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| - CTO
(configure-to-order) |
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PCB
assembly |
| - Lead
Free
Process |
| - No-Clean
Double
Side
SMT
and
Wave
Soldering
Process |
| - N2
Reflow
Soldering
Process |
| - Ultra
Fine
Pitch/0.4mm
Component
Assembly
Technology |
| - Flip
Chip
Assembly
Process |
| - High
Layer
Count
PCB
Assembly
Process |
| - Ceramic
Column
Grid
Array
Assembly
Technology |
| - High
Density
Press
Fit
Connector
Assembly
Technology |
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| Quality
management
programs |
| ·
XCSA
(Extended
Customer
Simulation
Audit) |
| ·
OOBA
(Out-of-box
audit) |
| ·
FMEA
(Failure
mode
effects
analysis) |
| ·
TQM
(total
quality
management) |
| ·
ORT
(on-going
reliability
test) |
| ·
DQA
(design
quality
assurance) |
| ·
DVT
(design
verification
testing |
| ·
SQA
(supplier
quality
assurance) |
| ·
CIP
(continuous
improvement
program) |
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| Testing
applications
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| ·
PCB
test |
| ·
ICT
(in-circuit
tester) |
| ·
ATE
(auto
test
equipment) |
| ·
Fly
probe |
| ·
AXI
(automated
x-ray
inspection) |
·
AOI
(automated
optical
inspection)
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Functional
test |
| ·
System
integration
test |
| ·
Pre-Run-in
test |
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Run-in
test |
| ·
Final
test |
| ·
Wireless
&
Telecom |
| ·
Communication
Test
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Multiple
S/W
platform |
| ·
ESS
(environmental
stress
screening) |
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